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Spherical Copper Powder > Copper Spherical Powder
(CUSP40) |
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Mean Particle
Size(SEM) |
¡¡4.0 § |
Particle
Size Distribution |
D10
: 2.5§ ¡¡ D50
: 4.2~4.7§ ¡¡ D90
: 5.7§ |
Target Properties |
Tap
Density : 4.6 g/§¨ ¡¡ BET
: 0.55 §³/g |
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Oxygen (wt%) max. : 0.25
Carbon (wt%) max. : 0.05
Sulphur (wt%) max. : 0.01 |
Application |
MLCC termination paste. Thick
film hybrid paste. Conductive adhesive. |
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![](images/sizeCUSP40.jpg) |
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![](images/CUSP40(2000).jpg) |
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![](images/CUSP40(5000).jpg) |
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