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Spherical Copper Powder

Flake copper powder

Silver Coated Powder

 
Spherical Copper Powder > Copper Spherical Powder (CUSP30)
Mean Particle Size(SEM)  3.0 ㎛
Particle Size Distribution D10 : 1.8㎛  D50 : 2.8~3.5㎛  D90 : 4.3㎛
Target Properties Tap Density : 4.5 g/㎤  BET : 0.50 ㎡/g
  Oxygen (wt%) max. : 0.30
Carbon (wt%) max. : 0.05
Sulphur (wt%) max. : 0.01
Application MLCC termination paste. Thick film hybrid paste. Conductive adhesive.
 
 
 
 
 
 
 
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